| Class | ITEMS | Current Status | Technology Readiness | |||
|---|---|---|---|---|---|---|
| E/2003 | E/2004 | E/2005 | ||||
| A. | Material | - | - | - | - | |
| 1. Material | FR4,FR5,BT,Polyimide,Teflon | |||||
| 2.Copper Foils | 0.25oz.(9um) / 0.33oz.(12um) / 0.5oz.(18um) / 1oz.(35um) / 2oz.(70um) | |||||
| B. | Lamination | |||||
| 1.Max. Numbers of layers | 20 | 28 | NA | NA | ||
| 2.Max. Board thickness | 5.5 | 6 | NA | NA | ||
| 3.Min. panel thickness tolerance | ||||||
| Panel thickness 0.38-0.77 | +/- 0.075 | +/- 0.075 | NA | NA | ||
| Panel thickness 0.78-2.0 | +/- 0.125 | +/- 0.125 | NA | NA | ||
| Panel thickness 2.01-3.15 | +/- 0.200 | +/- 0.200 | NA | NA | ||
| Panel thickness >3.16 | +/- 10% | +/- 10% | NA | NA | ||
| 4.Layer to layer registration | +/- 0.125 | +/- 0.125 | NA | NA | ||
| C. | Artwork Capabilities | |||||
| 1. Min. Trace and Space (0.25oz.) | 0.076 / 0.076 | 0.076 / 0.076 | 0.063 / 0.063 | 0.05 / 0.05 | ||
| 2. Min. Trace and Space (0.33oz.) | 0.1 / 0.1 | 0.1 / 0.1 | 0.076 / 0.076 | 0.063 / 0.063 | ||
| 3. Min. Trace and Space (0.5oz.) | 0.127 / 0.127 | 0.127 / 0.127 | 0.1 / 0.1 | 0.076 / 0.076 | ||
| 4. Min. Trace and Space (1.0oz.) | 0.15 / 0.15 | 0.15 / 0.15 | 0.127 / 0.127 | 0.1 / 0.1 | ||
| 5. Min. Space Outerlayer Trace to NPH | 0.25 | 0.25 | 0.2 | 0.2 | ||
| 6. Min. Space Innerlayer Trace to NPH | 0.3 | 0.3 | 0.25 | 0.25 | ||
| 7. Min. Space Outerlayer Trace to Board Edge | 0.25 | 0.25 | 0.2 | 0.2 | ||
| 8. Min. Space Innerlayer Trace to Board Edge | 0.4 | 0.4 | 0.35 | 0.35 | ||
| 9. Min. Outerlayer Pad Diameter = FHS plus | dr+0.35 | dr+0.35 | dr+0.30 | dr+0.25 | ||
| 10. Min. Innerlayer Pad Diameter = FHS plus | dr+0.4 | dr+0.4 | dr+0.35 | dr+0.3 | ||
| 11. Min. Innerlayer Plane Clearance = FHS plus | dr+0.6 | dr+0.6 | dr+0.5 | dr+0.4 | ||
| 12. Min. Space Between Coverlay Openings | 0.25 | 0.25 | 0.25 | 0.25 | ||
| 13. Edge of Coverlay Opening to Trace | .018 (preferred) |
.018 (preferred) |
NA | NA | ||
| 14. Min. Legend Line Width | 0.15 | 0.15 | 0.12 | 0.08 | ||
| D. | Drill Capabilities | |||||
| 1. Finish Hole Diameter Tolerance | ||||||
| . Plated | +/- 0.075 | +/- 0.075 | +/- 0.065 | +/- 0.050 | ||
| . Non-plated | +/- 0.025 | +/- 0.025 | +/- 0.025 | +/- 0.025 | ||
| 2. Cu Thickness in Through Hole | > 0.025 | > 0.025 | > 0.025 | > 0.025 | ||
| 3. Via Formation | ||||||
| Mechanical drilling | ||||||
| a. Aspect Ratio | 7 | 7 | 8 | 10 | ||
| b. Min. Drilled Microvia Diameter | 0.25 | 0.25 | 0.2 | 0.15 | ||
| c. Min. Finished Microvia Diameter | 0.2 | 0.2 | 0.15 | 0.1 | ||
| d. Min. Hole-edge-to-Hole edge(dependent on material and drill bit) | 0.35 | 0.35 | 0.3 | 0.25 | ||
| Laser drilling of microvias | ||||||
| a. Aspect Ratio | 0.7 | 0.7 | NA | NA | ||
| b. Min. Drilled Micro Via Diameter | 0.075 | 0.075 | NA | NA | ||
| c. Min. Finished Micro Via Diameter | 0.025 | 0.025 | NA | NA | ||
| Plasma etching | ||||||
| a. Aspect Ratio | NA | NA | NA | NA | ||
| b. Min. Etched Micro Via Diameter | NA | NA | NA | NA | ||
| c. Min. Finished Micro Via Diameter | NA | NA | NA | NA | ||
| E. | Fabrication Tolerances | |||||
| 1. Min. Trace to Route Edge Dimension | +/- 0.38 | +/- 0.38 | +/- 0.25 | +/- 0.2 | ||
| 2. Min. Route Dimensional Tolerance | +/- 0.13 | +/- 0.13 | +/- 0.1 | +/- 0.1 | ||
| 3. Min. Feature to Feature Dimensional Tolerance | +/- 0.13 | +/- 0.13 | +/- 0.1 | +/- 0.1 | ||
| 4. Impedance Tolerance (Design dependent) (50Ohm+) | +/- 10% | +/- 10% | +/- 8% | +/- 6% | ||
| F. | Fabrication Tolerances | |||||
| 1. Min. Solder mask clearance | ||||||
| . Plated (Pad plus) | 0.2 | 0.2 | 0.15 | 0.1 | ||
| . Non-plated (FSH plus) | 0.2 | 0.2 | 0.15 | 0.1 | ||
| 2. Min. Solder mask Width- on FR4 | 0.1 | 0.1 | 0.76 | 0.76 | ||
| G. | Surface Finish | |||||
| 1. Gold/Nickel(Electrolytic Pure Gold) | YES | YES | YES | YES | ||
| 2. Gold/Nickel(Electrolytic Hard Gold) | YES | YES | YES | YES | ||
| 3. Gold/Nickel (immersion/electroless) | ||||||
| a. Nickel thickness | > 3.8um | > 3.8um | > 3.8um | > 3.8um | ||
| b. Immersion Gold thickness | 0.05~0.1um | 0.05~0.1um | 0.05~0.1um | 0.05~0.1um | ||
| c. Electroless Gold thickness | 0.3~0.5um | 0.3~0.5um | 0.3~0.5um | 0.3~0.5um | ||
| 4. Selective EN/IMG + OSP | YES | YES | YES | YES | ||
| 5. HASL, solder thickness | 1.27~25.4um | 1.27~25.4um | 1.27~25.4um | 1.27~25.4um | ||
| 6. OSP Thickness | 0.2~0.5um | 0.2~0.5um | 0.2~0.5um | 0.2~0.5um | ||
| 7. Immersion Silver | NO | NO | YES | YES | ||
| 8. Immersion Tin | NO | NO | YES | YES | ||
| 9. No-Lead Compatible | NO | NO | YES | YES | ||
| H. | Electrical Test Capabilities | |||||
| 1. Smallest SMD Pitch | 0.25 | 0.25 | 0.25 | 0.25 | ||
| 2. Smallest BGA Pitch | 1 | 1 | 0.8 | 0.8 | ||
| I. | Controlled Impedance | |||||
| 1. Impedance Control Tolerance | +/- 10% | +/- 10% | +/- 8% | +/- 6% | ||
| 2. Differential Impedance Control Tolerance | +/- 10% | +/- 10% | +/- 8% | +/- 6% | ||
